Project Name:

Basic Information

Shipping Mode:?Panelized Delivery

SinglePanel

Panelization Parameters

File already panelized:

YesNo

Columns:

Rows:

Row Spacing:mm

Column Spacing:mm

Process Rail Width (Left/Right):mm

Process Rail Width (Top/Bottom):mm

Allow mouse-bite panelization:

AcceptDo Not Accept

Routing Slots:

YesNo

V-Scoring:

YesNo

Board Material:

FR4

Board Size:?Board Size

×mm

Enter the overall size after panelization here

Board Quantity:?Board Quantity (pcs)

20panel

*Select the quantity for assembled panels here

Board Layers:?Board Layers

1 layer(s)2 layer(s)4 layer(s)6 layer(s)8 layer(s)

Process Information

Board Thickness:?Board Thickness (mm)

0.40.60.81.01.21.62.02.4

Outer Copper Weight:?Outer Copper Weight

0.5oz 1.0oz 2.0oz 3.0oz 4.0oz

Minimum Drill:?Minimum Drill (mm)

0.150.200.250.30

mm

Minimum Trace/Space:?Minimum Trace/Space

3/34/45/56/6

mil

Solder Mask Color:?Solder Mask Color

GreenBlueRedYellowBlackMatte BlackWhite

Silkscreen Color:?Silkscreen Color

WhiteBlack

Surface Finish:?Surface Finish

Leaded HASLLead-Free HASLOSPENIGImmersion SilverImmersion TinBare Copper

Inspection Class:

Class 1Class 2Class 3

Blind/Buried Vias:?HDI (Blind/Buried Vias)

YesNo

Countersink:?Countersink

YesNo

Gold Fingers:

YesNo

Solder-Mask Covered Edges:

YesNo

Via in Pad:

YesNo

Controlled Impedance:?Controlled Impedance

YesNo

Electrical Test:

YesNo

First Article Confirmation:

YesNo

Remark: